It is possible that in the near future will begin to assemble electronic boards without solder - components are simply glued to the board at room temperature.
Scientists at Boston at Northeastern University have created a metallic adhesive MesoGlue ( http://mesoglue.com), conducting electricity and heat.
Clay consists of two components. One part is applied to the bonding composition comprising nanorods coated with indium. On the second - the composition, with the nanorods coated with gallium.
When indium and gallium is formed come into contact the liquid metal rods and then reacted with the liquid, and harden, becoming fastened continuation parts.
In fact, the items "welded", while achieving unprecedented for weld strength.
https://www.youtube.com/watch? v = TeOVQDzczzw
With MesoGlue can be "welded" to the radio board mount radiators to the chips, "welded" metal pipes, and in general any metal parts.
Ideologist and creator of the revolutionary adhesive is professor Hanchen Huang http://www.mie.neu.edu/people/huang-hanchen.
© 2016 Alex Nadozhin
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